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Student Assistant - High-Frequency Design
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Einführung
The Fraunhofer Institute for Reliability and Microintegration, IZM, is looking for a student assistant to support the team in high-frequency design and electronic packaging research.
Aufgaben
- Literature review on state of the art in high-frequency design of selected structures in electronic packaging
- Electromagnetic modeling, simulation and layout of selected electronic packaging structures
- High-frequency measurement of packaging structures and documentation of results
Voraussetzungen
- Studying electrical engineering, physics or a comparable subject
- Interest in high frequency/microwave engineering
- Willingness to learn, flexibility and a solution-orientated way of working
- Independent and structured working method
- Ability to work in a team and strong communication skills
- Good knowledge of German and/or English language
Benefits
- Introduction to electromagnetic modeling, simulation, layout and measurement of electronic packaging structures
- Continuation of activities as part of a Bachelor's/Master's thesis
- Flexible design options to suit the study plan
- Open and collegial working environment
- State-of-the-art laboratory equipment and software tools for high-frequency design, test and characterization up to 500 GHz
- Opportunity to participate in cutting-edge research and development projects with national and international partners
vor 3 Tagen
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